- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
Patent holdings for IPC class H01L 23/36
Total number of patents in this class: 3358
10-year publication summary
|
259
|
306
|
241
|
301
|
336
|
297
|
248
|
255
|
203
|
74
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 43934 |
209 |
| Mitsubishi Materials Corporation | 2378 |
116 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
108 |
| Fuji Electric Co., Ltd. | 4750 |
88 |
| Intel Corporation | 45621 |
75 |
| Rohm Co., Ltd. | 5843 |
74 |
| Dexerials Corporation | 1826 |
74 |
| Kyocera Corporation | 12735 |
70 |
| Denka Company Limited | 2189 |
66 |
| Samsung Electronics Co., Ltd. | 131630 |
65 |
| Murata Manufacturing Co., Ltd. | 22355 |
56 |
| Hitachi Astemo, Ltd. | 5618 |
53 |
| Denso Corporation | 23338 |
52 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
48 |
| International Business Machines Corporation | 60644 |
45 |
| Sumitomo Electric Industries, Ltd. | 14131 |
40 |
| Shin-Etsu Chemical Co., Ltd. | 5132 |
37 |
| Sumitomo Bakelite Co., Ltd. | 1416 |
37 |
| Micron Technology, Inc. | 24960 |
33 |
| Hitachi Automotive Systems, Ltd. | 3970 |
33 |
| Other owners | 1979 |